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SRAM
大容量SRAM是快速、高存储密度的随机访问存储器芯片，由多个SRAM基片采用立体封装工艺堆叠而成。广泛应用于航空航天领域嵌入式计算机系统。
订货信息：
技术文档：
| vdsr4m08xs44xx1c12-user manual.pdf | |
| vdsr8m16xs54xx2c12-user manual.pdf | |
| vdsr8m16xs54xx2v12-user manual.pdf | |
| vdsr8m32xs64xx2v12-user manual.pdf | |
| vdsr16m16xs54xx4c12-user manual.pdf | |
| vdsr16m16xs54xx4v12-user manual.pdf | |
| vdsr16m32xs64xx4c12-user manual.pdf | |
| vdsr16m32xs64xx4v12-user manual.pdf | |
| vdsr20m40xs84xx6v12-user manual.pdf | |
| vdsr32m32xs68xx8v12-Ⅱ-user manual.pdf | |
| vdsr32m32xs68xx8v12-user manual.pdf | |
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立体封装模块焊接后清洗建议(版本a2).pdf |
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立体封装模块加固建议(版本a0).pdf |
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立体封装模块手动装配规范(版本a2).pdf |
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立体封装模块自动回流焊装配规范(版本a3).pdf |
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- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
-
No record
- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
-
No record
- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
-
No record
